Substrate

FCBGA

Flip-chip ball grid array for CPU and ASIC packages. Solder-bump connection carries more interconnects at higher speed than gold wire.

Applications

• Data Center
• Automotive

FCCSP

Flip-chip chip-scale package. Bump connections replace bond wires, shortening the path between die and substrate — which suits high-speed and RF parts.

Overview

• A CSP substrate utilizing conductive solder bumps for electrical connection between die and substrate
• Suitable for faster data transmission by using flip chip bonding

Feature

• Array type lead free solder bump and stack ball
• Build - up technology plating available
• Stack via available
• MLCC embedding

Applications

• Mobile AP
• Power / Analog IC

CSP

Chip-scale package, where the die takes up most of the package footprint. Mainly used for flash memory and mobile DRAM.

Thin structure

• Multi Chip Packages require thinner substrates to stack more chips in a single package
• 80–100um total thickness using 35–40um laminates
• For proper handling of thin substrates, special guide can be applied
• Flat surface
• Via available (Cu filled)

Build-up structure

• High Functionality High Density packages using HDI build - up lamination
• Standard materials and laser drilling are used to create multi-layer, high density package substrates
• High density build-up structure
• Via fill plating available
• Stack via available

SiP / AiP

SiP brings several functions together into a single package so it can be handled as one system-level part. AiP goes further and builds the antenna into the substrate itself, which shortens the transmission path for 5G.

FCBOC

Flip-chip board on chip. Bumps shorten the distance between die and substrate to cut signal loss, mainly for DRAM.

Overview

• Fine Line Technology enables high speed DDR DRAM to reduce signal noise by using a short electrical path

Feature

• Slot Fabrication by Router of Punching without additional shaving
• Fine Line Technology(L/S=25㎛/25㎛)by subtractive process or MSAP process
• Dual substrates process available
• Multi Layer Process available

MLB

Multi-layer boards for equipment that needs many wiring layers rather than a package-scale substrate. The line splits into two, by what the board plugs into.

Wired Network

Boards for the switches and routers that carry wired network traffic. The engineering here is about holding signal integrity through the via structure — trimming unused via stubs, drilling repeatedly on the same point, and pushing aspect ratios higher as boards get thicker.

• Back drilling
• Double drilling
• High aspect ratio

Optical Module

Boards for the pluggable transceivers used in broadband data links. A module pairs an interface into the system with a plugging section that meets the fibre.

• BVH +3N3 build-up structure

Applications

• Data Center

High-end HDI

High-density interconnect boards for equipment where wiring density and signal integrity matter more than package size.

Applications

• Aerospace
• Optical Module
• Military
• Network Equipment (Router / Switch)
• Semiconductor (System / Tester)