Partners

We represent these manufacturers across Southeast Asia.

DAEDUCK ELECTRONICS

대덕전자

A global top-tier substrate manufacturer, supplying package substrates — FCBGA, FCCSP, CSP, SiP/AiP and FCBOC — alongside multi-layer boards and high-end HDI. Partner since 2010.

Supplies

Substrate

KORNIC SEMITECH

코닉세미텍

Korea's first in-house wafer sawing machine maker. Four lines — blade dicing saws, laser saw and grooving systems, wafer and mould grinders, and the accessories around a dicing line, including its own hub and hubless blades.

Supplies

Dicing & Sawing Systems

GST Co., Ltd.

지에스티반도체장비(주)

Flux cleaners for BGA and flip-chip packages, reel-to-reel plating and etching lines for lead frames and flexible film, and bench-scale etching and plating machines for pilot work.

Supplies

Flux Cleaning & Plating Systems

CNI Technology

씨앤아이테크놀로지

Package-level EMI shielding — in-line sputtering systems, the masking and dispensing tools around them, and the tape, adhesive and targets the process runs on. Also builds industrial in-line sputters and sputtering cathodes.

Supplies

EMI Shield Sputter

SEMES

세메스

Back-end packaging and test equipment — saw sorters, die bonders, auto mold, inspection, probe and test handling. Partner since 2006.

Supplies

Back-End & Test Equipment

Synapse Imaging Corporation

시냅스이미징

2D and 3D optical inspection for semiconductor packaging — standalone inspection machines and vision systems built into production equipment.

Supplies

Inspection Systems

Eleven Electron

일레븐전자

Process tapes for back-end packaging — EMI sputter, QFN backside, dicing — together with curing, packing, wafer handling and measurement equipment for the same line. Partner since 2026.

Supplies