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Semiconductor · Equipment

Dicing Saw, PLP Saw, Sawing Blade & Line Equipment

Stand-alone and in-line sawing machines, blades made in Korea, and the grinding and support equipment around a dicing line — configured around the process a customer runs.

Dicing Saw

Stand-alone blade dicing machines. The range covers wafer sawing, package tape sawing and panel tape sawing, from automatic benches up to fully automatic machines, and is configured around the process conditions and throughput a customer needs.

  • SD941 / SD741 — fully automatic package tape saws
  • SD642 (SD622) — fully automatic wafer saw
  • SD441 (SD421) / SD241 (SD221) / SD110 — automatic wafer saws
  • SD361 — panel tape saw

KORNIC built the first wafer sawing machine made in Korea, and produces the ultra-precise spindle stage in-house. Cutting accuracy is held mechanically rather than corrected in software, so it does not drift as the machine ages. Machines are customised to the customer’s process.

Dicing saw

Jig Saw & Placement (PLP Saw)

An in-line, fully automatic machine for semiconductor packages and panel-level packaging. Loading, jig sawing, cleaning and drying, inspection and sorting run as one pass, so strips or panels go in at one end and sorted parts come out the other. Both hardware and software are KORNIC’s own development.

Panels up to 700 × 700 mm are handled, including glass, moulded and ceramic panels.

  • SDH-730K / SDH-720K — jig saw and replacement, two throughput classes
  • SDM-841 — small package tape saw and replacement; strip mounting, tape sawing, cleaning and UV in one line, with inspection and pick-and-place available as an option

Jig saw and placement machine

Wafer Sawing Blade

Blades are designed and made by KORNIC in Korea, not sourced. Diamond particles are held evenly through the metal bond, which keeps kerf width and chipping down — the same property that shows up as both cut quality and blade life.

Blades are specified by kerf width, exposure, grit size, concentration and bond, so a blade can be matched to the material and the cut a customer is running.

  • Hub blades — precision hub blades
  • Hubless blades — ultra-thin hubless blades

Hub blade and its ordering code

Hubless blades

Laser Saw

Laser grooving and cutting in place of a blade, for layer stacks where mechanical dicing would chip or stress the die.

  • Laser Saw System for PCB
  • Laser Grooving System

Laser cut quality — cross-sections

Grinder System

Grinding for the back end — thinning wafers ahead of dicing, and taking mould compound down to target on packaged strips.

  • SG221 — wafer back grinder
  • SG240 — package mould grinder

Grinder system

Accessories

The equipment that sits around a dicing line: water treatment, cleaning, cooling and tape handling.

  • SMR3000 — waste water recycler
  • SCB-20L — CO₂ bubbler, anti-static for ultra-pure water
  • SSC-220 / SSC-240 — automatic spin cleaner
  • SCU-S130 — dicing chiller
  • SUV-140 — UV irradiator (12”)
  • STM-120 / STM-140 — wafer tape mounter (8” / 12”)

Accessory equipment