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Semiconductor · Equipment

Flux Cleaning, Plating & Etching Systems

Flux cleaners for BGA and flip-chip packages, reel-to-reel plating and etching lines for flexible film and lead frames, and bench-scale machines for trying a process before committing a line.

Flux Cleaning

  • GFC1316A — for BGA
  • GFC1501A — for flip chip
  • GFC2501A — for wafer, 8” and 12”

Flux cleaner Flux cleaner — wash chambers

Flexible Film

Wet process equipment for flexible substrates — FPCB, COF and ITO film, down to fine pitch. Each line is built to order around the customer’s process rather than sold as a catalogue model.

  • Exposure
  • Developing — also handles hard PCB and other sheet-type products
  • Etching and DFR stripping
  • Plating — additionally for FCCL, and for thin stainless steel and copper foil
  • Etching and cleaning, for the steps around the main line

Flexible film manufacturing line Film handling at the end of the line

Lead Frame Etching

Lines for etched lead frames in copper and copper alloy — QFP, MLF and QFN.

  • Developing, etching and stripping — the three steps run as one continuous inline pass
  • Ag post-plating — fully automatic, with an alarm system that flags an out-of-range condition during the run
  • PPF plating — Ni / Pd / Au pre-plated lead frame

Plating lines are reel-to-reel, covering Cu, Ag, Ni, Ni/Pd, Au and Sn.

Plating and etching line Reel-to-reel plating line

Test Equipment

Bench-scale machines for pilot and lab work — running a process at small scale to fix the chemistry and conditions before a production line is specified.

  • COF / ITO film etching — a pilot line, scaled down from the production version
  • Wafer plating
  • Developing and soft etching
  • Copper plating
  • Precious metal plating
  • Laboratory fume hood

Etching and plating simulation machine Plating test machine