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Semiconductor · Equipment

Flux Cleaning, Plating & Etching Systems

Flux cleaners for BGA and flip-chip packages, reel-to-reel plating and etching lines for flexible film and lead frames, and bench-scale machines for trying a process before committing a line.

Flux Cleaning

Inline cleaners that remove flux residue after reflow. Stainless steel construction throughout, running a fixed sequence — pre-wash, wash, rinse, final rinse, air blow, dry — with the workpiece carried through on a belt.

Advanced Flux Cleaner — for BGA

Three frame sizes, differing in belt width and rinse water temperature.

  • GFC-1210A — 470 mm belt, DI water at 35 ± 5 ℃
  • GFC-1310A — 550 mm belt, DI water at 35 ± 5 ℃
  • GFC-1315A — 550 mm belt, DI water at 45 ± 5 ℃

Belt speed is 5–38 inch/min across the range. Handles PBGA, FBGA, SBGA, TBGA and μBGA.

The machine is built in two types by solder alloy — one for eutectic BGA, one for Pb-free BGA.

Flux cleaner Flux cleaner — wash chambers

Chip Attachment Flux Cleaner — for flip chip

A longer machine built for flip-chip devices, with DI water at 45 ± 5 ℃ and higher flow. Rinse water contamination and chemical concentration are both measured automatically as the line runs, so drift is caught without an operator sampling by hand.

Flexible Film

Wet process equipment for flexible substrates — FPCB, COF and ITO film, down to fine pitch. Each line is built to order around the customer’s process rather than sold as a catalogue model.

  • Exposure
  • Developing — also handles hard PCB and other sheet-type products
  • Etching and DFR stripping
  • Plating — additionally for FCCL, and for thin stainless steel and copper foil
  • Etching and cleaning, for the steps around the main line

Flexible film manufacturing line Film handling at the end of the line

Lead Frame Etching

Lines for etched lead frames in copper and copper alloy — QFP, MLF and QFN.

  • Developing, etching and stripping — the three steps run as one continuous inline pass
  • Ag post-plating — fully automatic, with an alarm system that flags an out-of-range condition during the run
  • PPF plating — Ni / Pd / Au pre-plated lead frame

Plating lines are reel-to-reel, covering Cu, Ag, Ni, Ni/Pd, Au and Sn.

Plating and etching line Reel-to-reel plating line

Test Equipment

Bench-scale machines for pilot and lab work — running a process at small scale to fix the chemistry and conditions before a production line is specified.

  • COF / ITO film etching — a pilot line, scaled down from the production version
  • Wafer plating
  • Developing and soft etching
  • Copper plating
  • Precious metal plating
  • Laboratory fume hood

Etching and plating simulation machine Plating test machine