Back-End and Test Equipment

Back-End Solutions

Equipment for the packaging line: separating the moulded strip into individual packages, bonding the die, encapsulating it, and checking the result. Applied to QFN, BGA and FCBGA packages.

Saw Sorter

Cuts moulded lead frames and PCBs into individual packages and sorts them by inspection result. Cutting quality is checked in the machine by a camera system configured to the customer’s criteria.

SW6000PLUS

• RCPM (Rotate Chip Picker Module) corrects alignment during pick
• High-definition camera inspection — orientation, ball, marking, package align, and side vision as an option
• Minimised vibration and maximised durability
• Tool changeover and maintenance kept simple

Die Bonder

Picks the separated die and bonds it to the substrate or lead frame.

Auto Mold

Encapsulates the bonded die in moulding compound to form the package body.

Wafer Inspection

Checks the wafer for defects ahead of the packaging steps.

Tool & Kit

Change parts and tooling for the machines above, supplied per package type.

Test Solutions

Equipment for the electrical test steps, and for moving and storing material through the line.

Probe Station

Brings a probe card into contact with the wafer so each die can be tested electrically before packaging.

Test Handler

Feeds finished packages to the tester under the required conditions and sorts them by result.

Hi-Fix & COK

The boards that carry devices into the tester, and the change-over kits that convert a handler from one package type to another.

Line Automation

Transport and storage systems that move material between process steps.