KOSemiconductor · Equipment
Packaging & Wafer Automation Equipment
Automation around the back-end line — curing ovens and packing systems, wafer handling and tape lamination, and the measurement systems that check what came out.
Semiconductor Packaging Equipment
Compression Molding System
Moulds the package body by compression rather than transfer.
Automation Tunnel Oven
A continuous oven that carries material through on a conveyor instead of batching it into a chamber, so curing runs in line with the rest of the process.
Automated PMC Oven
Post mould cure, automated — loading and unloading handled by the machine rather than an operator.
Auto Reel Packing System
Takes finished parts through to tape-and-reel packing without manual handling.
Tray Binding System
Stacks and binds loaded trays for transport.
Wafer Automation Systems
Skeleton Wafer Management System
Maps and folds skeleton wafers — the frame left behind once the dies have been picked — so the leftover material is handled and tracked rather than piling up at the station.
Wafer Ring Frame Cleaning System
Cleans ring frames so they go back into circulation instead of being discarded.
Tape Lamination System
Laminates QFN backside tape onto the lead frame ahead of moulding.
Tape De-lamination System
Removes the tape once the process step it was there for is finished.
Monitoring Systems
Measurement rather than handling — systems that check the result and feed the number back.
X-Ray Fluorescence (XRF) Measuring System
Measures plating and coating thickness and composition without cutting the part open.
Flatness Measurement System
A 3D laser line profiler that measures warpage and flatness across a strip or substrate.
Roughness Measurement System
Measures surface roughness.