Packaging Tapes

Tape in a packaging line is not packing material. It holds parts in place through a process step and then has to come off without leaving anything behind — after 400 ℃, after a vacuum, after a saw blade has passed through it. What separates one tape from another is the residue, the outgassing and how the adhesion behaves at temperature.

EMI Shielding Sputter Tape

Holds packages in place while the shielding layer is sputtered on, then releases. Two types.

Silicone adhesive type — built for the heat. Withstands up to 400 ℃, keeps its grip above 200 ℃, and leaves no residue after two hours at 200 ℃. Outgassing is kept low so it does not contaminate the vacuum.

UV curable type — adhesion drops when the tape is exposed to UV, so packages lift off easily at the end. Laminates cleanly with good ball dipping and minimal voids, and takes a saw cut well.

QFN Backside Tape

Applied to the back of the lead frame to stop resin bleeding out during moulding. Thermally stable through the mould cycle, with no mould flash and low outgassing.

High modulus, which is what keeps wire bonding stable in both pre-tape and post-tape processes. Comes off without residue.

Package Dicing Tape

Holds the package firmly while the blade goes through — adhesion has to be high or the parts move. UV exposure afterwards drops the adhesion so pick-up is easy, and nothing is left on the package once it is cured.

FM Removal Tape

For lifting foreign material off a surface before the next step.

PKG Grinding Tape

Protects and holds the package face during grinding.