JEDEC Tray

IC JEDEC Tray

The standard matrix tray a packaged device sits in through test, handling and shipping. Moulded to hold its shape and its dimensions under heat and impact, so the pockets still locate the device after repeated cycles.

Available in conductive and dissipative grades depending on how much the device needs protecting from static, and rated for 180 ℃ moulding conditions without becoming brittle. Fits TSOP, QFP, QFN and BGA CSP packages.

Shipping Tray

Vacuum-formed trays for moving product between sites. Sheet stock from 0.5 T to 2.2 T, formed to whatever the part needs rather than to a fixed catalogue shape.

Module Tray

For memory modules and LCD modules — plastic vacuum-formed trays that take the module’s own outline, so it is held rather than rattling in a generic pocket. Made regardless of the customer’s PCB shape or size.

Engraved and embossed forming run in the same operation, which is what allows an inner wall down to 0.7 T.

Blister Tray

Clear formed packs for small parts and accessories, sealed for shipping.

Others

Chip trays are injection moulded for a range of chip sizes — 2, 3 and 4 inch among them — and can be produced in more than fifteen colours straight from the raw material rather than by painting.

Also supplied: carrier tape, wafer ring carriers and metal SSD enclosures.