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Semiconductor · Materials

Substrate

CSP substrates using flip-chip bonding for faster data transmission. FCCSP, thin CSP and build-up CSP.

FCCSP

Overview

  • A CSP substrate utilizing conductive solder bumps for electrical connection between die and substrate
  • Suitable for faster data transmission by using flip chip bonding

Feature

  • Array type lead free solder bump and stack ball
  • Build - up technology plating available
  • Stack via available
  • MLCC embedding

FCCSP

Thin CSP

Overview

  • Multi Chip Packages require thinner substrates to stack more chips in a single package.

Feature

  • 80–100um total thickness using 35–40um laminates
  • For proper handling of thin substrates, special guide can be applied
  • Flat surface
  • Via available (Cu filled)

Thin CSP

Build - up CSP

Overview

  • High Functionality High Density packages using HDI build - up lamination
  • We use standard materials and laser drilling to create leading technology, multi-layer, high density package substrates.

Feature

  • High density build-up structure
  • Via fill plating available
  • Stack via available

Build - up CSP

BOC

Overview

  • Fine Line Technology enables high speed DDR DRAM to reduce signal noise by using a short electrical path

Feature

  • Slot Fabrication by Router of Punching without additional shaving
  • Fine Line Technology(L/S=25㎛/25㎛)by subtractive process or MSAP process
  • Dual substrates process available
  • Multi Layer Process available

BOC