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Semiconductor · Materials
EMC & Film
Epoxy moulding compound, die attach film and underfill for memory, power devices and system IC.
EMC (Epoxy Molding Compound)
- OverviewSince 1985 Application
- Memory 30%, Power Device 60%, System IC 10%
- China 45%, Korea 40%, S. Asia 10%, ROW 5%Total 39 Employees
- Sales 9, R&D 23, Production 7 KCC BENEFITS Long Years EMC experienced Maintain Advanced EMC Solutions : C-Mold/Granule, Thermal release, MUF, WLP