DIGILOGTECH PTE LTD
  • Who We Are
    • About us
    • History
    • Partners
  • Products
    • Chemicals
    • Dicing Blade
    • Substrate
    • Solder Ball
    • EMC & Film
    • Magazines, Boats, Carrier, Wafer Ring
    • SiC Product
    • IC Tray & Others
    • Back end equipments >
      • Wafer Dicing Saw, Strip Grinder, Chiller & Waste Water Recycling System
      • Saw and Sorter
      • ​Package EMI ​Sputter System
      • Pick & Place, Laser Marking System
      • OCR Bar Code, Wafer Mounter/Demount System
      • Inspection machine
      • Laser & CO2 cleaning machine
  • Consulting
  • Contact Us

Dicing Blade

Establishment
     ► 1991. 9.  Established  Intertek Engineering Co.
     ► 1994. 4.  Changed Company Name to Fine International Co.,Ltd.


  • Product Overview​
         ► Dicing Blades (2", 3", 4.5“, 5“)
              Metal Blade :  Package & Quartz Sawing
              Resin Blade : QFN Package, Quartz, LED, Glass wafers & IR Filter Glass Sawing
              Electroplated Hub Blade : Wafer  & Package Sawing 
​         ► Forming Wheel  : Micro SD Card Forming

Metal Blade

Resin Blade

Electroplated Hub Blade

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▪ Non ferrous powders
▪ High bond strength
▪ Lower rate of wear
▪ Reduced round wear of blade edge
▪ Excellent for semiconductor packages,
  ceramics, ferrite, soft glass and quartz 
▪ FRS Series (Soft Resin)
▪ Excellent accuracy
▪ Minimize chipping
▪ No crack or crack propagations
▪ Expect long blade life time 
​▪ Nickel is plated
▪ High accuracy in micro scale
▪ Good grit exposure
▪ Outstanding accuracy cutting ability
▪ Excellent for cutting silicon and compound semiconductor
  and oxide wafer 
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​​Partner

  • Who We Are
    • About us
    • History
    • Partners
  • Products
    • Chemicals
    • Dicing Blade
    • Substrate
    • Solder Ball
    • EMC & Film
    • Magazines, Boats, Carrier, Wafer Ring
    • SiC Product
    • IC Tray & Others
    • Back end equipments >
      • Wafer Dicing Saw, Strip Grinder, Chiller & Waste Water Recycling System
      • Saw and Sorter
      • ​Package EMI ​Sputter System
      • Pick & Place, Laser Marking System
      • OCR Bar Code, Wafer Mounter/Demount System
      • Inspection machine
      • Laser & CO2 cleaning machine
  • Consulting
  • Contact Us