Establishment
► 1991. 9. Established Intertek Engineering Co.
► 1994. 4. Changed Company Name to Fine International Co.,Ltd.
- Product Overview
Metal Blade : Package & Quartz Sawing
Resin Blade : QFN Package, Quartz, LED, Glass wafers & IR Filter Glass Sawing
Electroplated Hub Blade : Wafer & Package Sawing
► Forming Wheel : Micro SD Card Forming
Metal Blade |
Resin Blade |
Electroplated Hub Blade |
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▪ Non ferrous powders
▪ High bond strength ▪ Lower rate of wear ▪ Reduced round wear of blade edge ▪ Excellent for semiconductor packages, ceramics, ferrite, soft glass and quartz |
▪ FRS Series (Soft Resin)
▪ Excellent accuracy ▪ Minimize chipping ▪ No crack or crack propagations ▪ Expect long blade life time |
▪ Nickel is plated
▪ High accuracy in micro scale ▪ Good grit exposure ▪ Outstanding accuracy cutting ability ▪ Excellent for cutting silicon and compound semiconductor and oxide wafer |
Partner