IC Tray,  Module Tray, Chip Tray

IC  Tray 
  • Product Overview
    Raw and supplementary material for packing semiconductor designed and manufactured to prevent electric wave and static electricity that can infiltrate from outside and protect the semiconductor material from outside shock or high temperature.
  • Product Characteristics
    - Molding product requiring thermal resistance, shock resistance
    ​   and precision
    - Applied to all package such as TSOP, QFP,QFN, BGA CSP
    - Conductive type and dissipative type applicable
    - Non-breakable and Applicable to 180°C molding condition
Module Tray
  • Product Overview
    Semiconductor and LCD module products are the plastic vacuum molding products produced to safely protect from outside shock and electric waves.
  • Product Characteristics
    - Various raw material sheets applicable from 0.5 T to 2.2 T
    - Applicable regardless of client's PCB shape or size
  • Technologies
    - Vacuum forming, engraved and embossed molding at the same time
      ( Embodiment of at least 0.7 T of inner thickness of module tray )
Chip Tray
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  • Product Characteristics
    - Applicable to a variety of chip sizes. ( 2, 3, 4 Inch, etc )
    ​- Possible injection molding more than 15 different colors through raw materials.
Others
Carrier Tape
Wafer Ring Carrier
Metal SSD Enclosure
Picture

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