DIGILOGTECH PTE LTD
  • Who We Are
    • About us
    • History
    • Partners
  • Products
    • Substrate
    • Solder Ball
    • EMC & Film
    • Magazines, Boats, Carrier, Wafer Ring
    • IC Tray & Others
    • Back end equipments >
      • Saw and Sorter
      • Memory Tester, SSD Tester, UFS Tester
      • ​Package EMI ​Sputter System
      • Pick & Place, Laser Marking System
      • OCR Bar Code, Wafer Mounter/Demount System
      • Inspection machine
      • Laser & CO2 cleaning machine
  • Consulting
  • Contact Us

Substrate

  FCCSP

Picture
*Overview
-A CSP substrate utilizing conductive solder bumps for electrical connection between die and substrate 
-Suitable for faster data transmission by using flip chip bonding

*Feature
-Array type lead free solder bump and stack ball
-Build - up technology plating available
-Stack via available
-MLCC embedding

  Thin CSP

Picture
*Overview
-Multi Chip Packages require thinner substrates to stack more chips in a single package. 
*Feature
-80~100um total thickness using 35~40um laminates
- For proper handling of thin substrates, special guide can be applied
-Flat surface

-Via available (Cu filled)

Build - up CSP

Picture
*Overview
-High Functionality High Density packages using HDI build - up lamination
-We use standard materials and laser drilling to create leading technology, multi-layer, high density package substrates.

*Feature
-High density build-up structure
-Via fill plating available
-Stack via available
​

BOC

Picture
*Overiew
-Fine Line Technology enables high speed DDR DRAM to reduce signal noise by using a short electrical path
*Feature
- Slot Fabrication by Router of Punching without additional shaving
-Fine Line Technology(L/S=25
㎛
/25㎛)by subtractive process or MSAP process
-Dual substrates process available
-Multi Layer Process available 
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Partner 

  • Who We Are
    • About us
    • History
    • Partners
  • Products
    • Substrate
    • Solder Ball
    • EMC & Film
    • Magazines, Boats, Carrier, Wafer Ring
    • IC Tray & Others
    • Back end equipments >
      • Saw and Sorter
      • Memory Tester, SSD Tester, UFS Tester
      • ​Package EMI ​Sputter System
      • Pick & Place, Laser Marking System
      • OCR Bar Code, Wafer Mounter/Demount System
      • Inspection machine
      • Laser & CO2 cleaning machine
  • Consulting
  • Contact Us