Description and Main Function/Feature

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Wafer OCR barcode print M/C
  • Prints Barcode Label After Read ID Mark for Wafer with Vision System and attaches in wafer frame or laminating film before wafer sawing.
  • Applied Wafer : 6” , 8” . 8”, 12” ( Flat , Notch )
  • Feature : OCR ID Recognition 99.8%, ID & Label print position is set automatically
Wafer Demount System
  • Full Automatic De-Laminating system is designed to de-laminate tape (UV or Non UV) which is laminated on the wafer without any wafer Damage.​​
  • This system is composed of, Wafer Cassette Loading module, Wafer aligner module, UV irradiator module, Wafer transfer robot, De-laminating module, Frame & base.
Wafer Tape Remover
  • After wafer back grained, this system has removed the laminating tape of Wafer’s Pattern surface
  • Applied Wafer : 6” , 8” . 8”, 12” ( Flat , V NOTCH )
  • Feature : safety device to prevent wafer breakage. Force to maintain a constant angle and fitted pressure. Recording camera, Tape tension sensor
Picture

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