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Dicing Blade
Substrate
Solder Ball
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Wafer Dicing Saw, Strip Grinder, Chiller & Waste Water Recycling System
Saw and Sorter
Package EMI Sputter System
Pick & Place, Laser Marking System
OCR Bar Code, Wafer Mounter/Demount System
Inspection machine
Laser & CO2 cleaning machine
Consulting
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Description and Main Function/Feature
Wafer OCR barcode print M/C
Prints Barcode Label After Read ID Mark for Wafer with Vision System and attaches in wafer frame or laminating film before wafer sawing.
Applied Wafer : 6” , 8” . 8”, 12” ( Flat , Notch )
Feature : OCR ID Recognition 99.8%, ID & Label print position is set automatically
Wafer Demount System
Full Automatic De-Laminating system is designed to de-laminate tape (UV or Non UV) which is laminated on the wafer without any wafer Damage.
This system is composed of, Wafer Cassette Loading module, Wafer aligner module, UV irradiator module, Wafer transfer robot, De-laminating module, Frame & base.
Wafer Tape Remover
After wafer back grained, this system has removed the laminating tape of Wafer’s Pattern surface
Applied Wafer : 6” , 8” . 8”, 12” ( Flat , V NOTCH )
Feature : safety device to prevent wafer breakage. Force to maintain a constant angle and fitted pressure. Recording camera, Tape tension sensor
Partner
Who We Are
About us
History
Partners
Products
Chemicals
Dicing Blade
Substrate
Solder Ball
EMC & Film
Magazines, Boats, Carrier, Wafer Ring
SiC Product
IC Tray & Others
Back end equipments
>
Wafer Dicing Saw, Strip Grinder, Chiller & Waste Water Recycling System
Saw and Sorter
Package EMI Sputter System
Pick & Place, Laser Marking System
OCR Bar Code, Wafer Mounter/Demount System
Inspection machine
Laser & CO2 cleaning machine
Consulting
Contact Us