Who We Are
About us
History
Partners
Products
Chemicals
Dicing Blade
Substrate
Solder Ball
EMC & Film
Magazines, Boats, Carrier, Wafer Ring
SiC Product
IC Tray & Others
Back end equipments
>
Wafer Dicing Saw, Strip Grinder, Chiller & Waste Water Recycling System
Saw and Sorter
Package EMI Sputter System
Pick & Place, Laser Marking System
OCR Bar Code, Wafer Mounter/Demount System
Inspection machine
Laser & CO2 cleaning machine
Consulting
Contact Us
EMC (Epoxy Molding Compound)
* Overview
Since 1985
Application
- Memory 30%, Power Device 60%, System IC 10%
- China 45%, Korea 40%, S. Asia 10%, ROW 5%
Total 39 Employees
- Sales 9, R&D 23, Production 7
KCC BENEFITS
Long Years EMC experienced
Maintain Advanced EMC Solutions : C-Mold/Granule, Thermal release, MUF, WLP
DAF (Die Attach Film)
Underfill
Partner
Who We Are
About us
History
Partners
Products
Chemicals
Dicing Blade
Substrate
Solder Ball
EMC & Film
Magazines, Boats, Carrier, Wafer Ring
SiC Product
IC Tray & Others
Back end equipments
>
Wafer Dicing Saw, Strip Grinder, Chiller & Waste Water Recycling System
Saw and Sorter
Package EMI Sputter System
Pick & Place, Laser Marking System
OCR Bar Code, Wafer Mounter/Demount System
Inspection machine
Laser & CO2 cleaning machine
Consulting
Contact Us