Product Development
Pick&Place Handler
  • Tray to Boat / Boat to JEDEC Tray
  • Application device : FCBGA (Min. 10x10~Max. 55 x 55 mm )
  • 5 Matrix Boat Magazine / 10 single Boat Magazine Loading
  • Conversion tool : Less 10 mins
    Boat block (Single&Matrix), Picker pad (device etc.)
  • Dual Pick up head / 6 Picker per each Head (each Z , θaxis motion )
  • Inspection Vision & Align Vision
  • Dual Boat Transfer
  • Dual Good Tray Transfer / Dual Reject Tray Transfer
  • Integration with Deflux system
Laser Marking System
- Substrate Marking
  • Loading/Unloading : Stack or Cassette Magazine
  • Device : All kinds of PKG substrate
  • 2D Barcode / Strip : 6 ~ 10 ea (2D size : 1.2 x 2.6)
  • Number of Letter : Max 20 letters in 1.6 x 2.6
  • Warp Control : Less 50um
  • Visoin : 2D Barcode Marking Quality
  • Marking Accuracy : +/- 100um
  • Laser : CO2 10W
-Wafer Marking
  • ​Loading/Unloading : Wafer Cassette to Cassette
  • Applicable Wafer : 8" & 12"
  • Marking Accuracy : X-Y accuracy +/- 75um
  • Laser Line Width : 50 ~ 130 um
  • 12" Base : 15 min
  • Vision : Wafer Align / OCR Reading / Marking Vision
  • Laser Control : APC (Auto Power Control) available
Test Handler
  • Handling packages: Logic semiconductor packages
  • Handling device size: 2x2 ˜50x50
  • Interface type: DIO, GPIB, RS-232C
  • Throughput:3,500 ˜ 5,500 UPH
  • Test methods: Bottom pin direct lead contact type
  • Test integration: O/S tester or logic tester system
  • Vacuum: Built-in vacuum generator
  • Device conversion time: <10 mins
  • Plug-in accuracy (position accuracy: +/-0.05mm
  • Plunger pressure control: Electrical regulator type
  • Docking type: hard lock type and vertical docking plane
  • Optional item : Hot plate & picker rotator
    * Model : 4para / 16para / 32para type
  • In-shuttle: dual shuttle
  • (4 devices handling)
  • In-shuttle sensor detect device
  • tilt (mis-aligned device placement) 
2D Bar Code Marking System
  • Cassette to cassette magazine
  • Application device : MLF lead frame (length 200~295mm, width 50~105mm) 
  • Lead frame type : PPF, Bare Cu, Roughened Cu 
  • Laser : IR fiber 30 watt (marking area : 184x322mm) 
  • Scanner ; 2 scanner, 1064nm wavelength 
  • Marking position tolerance : +/-100um
  • Marking repeatability : +/-0.5mm 
  • Min letter size : o.5mm
  • Barcode size : Marking position tolerance : +/-100um
  • Marking repeatability : +/-0.5mm 
  • Min letter size : o.5mm
EMI Shielding Line (Sputter Type)
-Film Mounter
  • Tape size : 330 mm
  • Applicable size : 350mm square frame & circular frame is applicable
  • UPH : Over 70 frames
  • Vision : Frame 2D code reading
  • Quality : No wrinkle & air bubble (less than 5mm)​
  • Loading accuracy : Max +/- 50um
- Film Laser Cutting (BGA Type)
  • ​Laser : 355 wavelength UV laser
  • Cutting accuracy : Max +/-50um
  • Working field : 150 x 150mm
  • Vision : 2D Barcode reading, Un-cutting unit
  • Cutting pitch : 2.5mm (programmable)
  • UPH : 12~14K (1 square ring with 460 units)
  • Picker : Dual frame handing for higher UPH
-Loader
  • Minimum size : 2mm X 2mm  (based on tray handling)
  • UPH : 9K – 10.5K (depends on PKG size)
  • Traceability : Frame 2D & device 2D code reading vision
  • Vision : 2D code reading vision, film pocket PRS & loading inspection, loading position inspection, device PRS, picker position inspection : 
  • Loading accuracy : Max +/- 50um
  • Pick and place to Square Frame : Full unit population or partial population (programmable by MMI setting)
-Unloader
  • ​Minimum size : 1.6 mm X 1.6 mm  (based on tray handling)
  • Applicable device : LGA, BGA,  eMMC
  • UPH : 9K  (depends on PKG size)
  • Vision : Align, Mapping, Top & 5 sides, 2D Ball Inspection
  • Quality : No ball damage, No side scratch, No metal burr
  • Loading accuracy : Max +/- 50um
  • Burr removal : Brushing function to remove edge burr
Tray to Boat System with Tray Transfer
SMT & SIP Automation
  • SMT
  • SIP
​Universal Tape&Reel
  • Load/Unload : Ring to reel & tray to reel
  • Vision : 1st Pre-align, 2nd Unit Align, 3rd Unit Orientation
  • Device Size : 14.68 x 2.5
  • Picker : Single Picker Robot Unit (8 Pickers)
  • Feeding : Dual Tray Feeding Table Design
  • UPH : Tray to Reel (12K), Ring to Reel (8K)
Wafer Mount&Transfer
  • Loading : Wafer Film Frame Loading by Cassette
  • Wafer Size : 8" & 12"
  • Film Removal : Dicing & BG Film Removing with UV Curing
  • Peel Off : Dicing & BG Tape Peeling Unit
  • Attach : Dicing Tape & BG tape & PI Film Attach Unit
  • Wafer Transfer : Wafer Transfer Unit (Dual)
  • PI Tape Mount : PI Tape Mounting on CMOS
  • UPH : 30 EA
Picture

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