Core materials and back-end process equipment, supplied across Southeast Asia.
Semiconductor
Semi-automatic dicing saws, strip grinders, temperature-control chillers and waste water recycling systems.
Cutting and sorting moulded leadframes and PCBs, with high-definition camera inspection built in.
Cubicle-type sputtering system for package EMI shielding. Applied to package, glass and wafer substrates.
Reads wafer IDs by vision, prints barcode labels, and de-laminates tape without damaging the wafer.
Inspects defects on the top and bottom of package strips after moulding, overcoming 2D limits with 3D measurement.
Laser cleaners for logic sockets and probe cards, plus CO2 jet cleaning systems.
Blades for package, quartz and wafer sawing. Metal, resin and electroplated hub types, plus forming wheels.
CSP substrates using flip-chip bonding for faster data transmission. FCCSP, thin CSP and build-up CSP.
Solder balls for smaller, lighter and higher-function semiconductors and mobile devices. Composition and diameter made to order.
Epoxy moulding compound, die attach film and underfill for memory, power devices and system IC.
Magazines, boats, cassettes and wafer ring frames — standard sizes and custom fabrication.
SiC parts and coated products made by CVD process. Longer life than silicon with no thermal deformation.
Trays protecting semiconductors from static and shock. Applied across TSOP, QFP, QFN and BGA CSP packages.
Automotive
Polyurethane raw materials for automotive interiors, furniture and refrigerator insulation. Shipped in drums or ISO tankers.
