Core materials and back-end process equipment, supplied across Southeast Asia.
Semiconductor
Stand-alone and in-line sawing machines, blades made in Korea, and the grinding and support equipment around a dicing line — configured around the process a customer runs.
Packaging line equipment — sawing and sorting, die bonding, moulding and inspection — together with probe, test handling and line automation. For QFN, BGA and FCBGA.
Package-level EMI shielding — the sputtering system itself, the masking and dispensing machines around it, and the tape, adhesive and targets the process consumes.
Flux cleaners for BGA and flip-chip packages, reel-to-reel plating and etching lines for flexible film and lead frames, and bench-scale machines for trying a process before committing a line.
Optical inspection for semiconductor packaging — standalone 2D/3D inspection machines for package strips, stacked packages, image sensor packages and wafers, plus vision systems that run inside other equipment on the line.
Automation around the back-end line — curing ovens and packing systems, wafer handling and tape lamination, and the measurement systems that check what came out.
Package substrates and multi-layer boards — FCBGA, FCCSP, CSP, SiP/AiP and FCBOC, plus MLB and high-end HDI.
The metalwork a line runs on — magazines and cassettes that move strips between stations, boats that hold parts through an oven, and ring frames that carry the wafer through dicing.
JEDEC matrix trays, vacuum-formed shipping and module trays and blister packs — the carriers a finished device sits in from test through to the customer.
Process tapes for back-end packaging — holding packages through sputtering, sealing the lead frame during moulding, and carrying the wafer through dicing.
Automotive
Polyol, POP and MDI — the two halves of polyurethane, supplied to foam producers for automotive seating, furniture and insulation.
KO
